Re: de-solder part side or underside


"Richard Crowley" <rcrowley@xxxxxxxxx> wrote in message
news:11rvh2ambgmqj0b@xxxxxxxxxxxxxxxxxxxxx
> antonlamont45 wrote ...
>> when removing a part from a circut board, should i heat the part side or
>> the underside? i am guessing the underside since thats where you're
>> supposed to solder just wanted
>> to make sure.
>
> Assuming that you are talking about "thur-hole" components
> (the ones with wire leads that go through holes in the PC
> board). The technique for "surface-mount devices" is
> clearly different.
>
> Yes, you almost always melt the solder from the bottom side and grip the
> component from the other side to pull
> it out.

In doing so you must make sure the iron is on the joint long enough to melt
the component side solder joint too, otherwise pulling the component out
will pull the through-hole plating with it, and/or the pad and attatched
track.


Gareth.



>> also, when the part is removed should i be removing the existing solder
>> before soldering a new part on?
>
> Usually, yes.
>
> Recommend getting an old discarded junker gadget and
> practice your soldering skills before going for the real
> thing.


.

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