Re: BGA reflow soldering using vapor phase
- From: Antti <Antti.Lukats@xxxxxxxxxxxxxx>
- Date: Wed, 19 Dec 2007 04:10:41 -0800 (PST)
On 18 Dez., 20:07, kislo <kisl...@xxxxxxxxxxxxxx> wrote:
I am doing some initial research regarding PCB design process with a
Spartan3E (FT256) .. Have i understood it correctly that avnet are the
only distributor of xilinx FPGA´s ? .. in that case, i can order a
Spartan3E witch is not lead free .. and here comes the problem -> we
have vapor phase equipment to solder the BGA on the PCB. This vapor
phase machine uses liquid which reach 240degrees (Pb-free soldering),
will this damage the non-Pb-free FPGA? If it does, i have to convince
some ppl to buy some other liquid with lower vapor temperature :/
I have read the Device Package Userguide (ug112), regarding the Reflow
soldering process .. it dosent address the vapor phase process but i
guess its the same as for a normal oven process? .. is it critical to
obey the ramp temperature requirements?
Regards
Kim
there are several suppliers, not only avnet, so try push all of them
to get pb-free versions
vapor thing is almost the ONLY thing suitable for BGAs, so if you have
that equipment be happy.
for best results the correct temperature profile is sure required, but
i guess your assembly department will know about that.
you possible can use the pb-free profile for pb package too, at least
for the development boards
Antti
.
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