Re: placing addiional caps across existing caps to reduce noise

Austin Lesea wrote:
Rick,

Via in pad (basically no trace) is best. Placement is not critical, as
long as you have via in pad, and planes.

My memory is fuzzy on this (and other topics for that matter) but I
think via in pad creates an assembly issue because the pad of the part
is physically blocking the via (by design). Unfortunately I don't
recall the specifics, maybe someone else recalls.

Unless you already understand the issue (that I've conveniently
forgotten) I would suggest that whoever is going to be building your
boards be consulted to understand if there are appropriate tradeoffs
that can be made prior to planning to use 'via in pad' since
manufacturability is also generally a concern that at least must be
taken into consideration and evalutated.

KJ

.

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