Re: What is this Heat Pad?



Just an attempted correction. A 0.5mm sphere is the diameter of a
relatively small mechanical pencil lead. You may need more than that. :)
Follow the directions on the package.

Clint

"MCheu" <mpcheu@xxxxxxxxx> wrote in message
news:e0ub92hqblfpc28oh8lcpsorkoaggvjl2g@xxxxxxxxxx
On Sun, 18 Jun 2006 20:30:54 -0400, "contrapositive"
<contrapositive@xxxxxxxxxxx> wrote:

I haven't built a PC in a while, but I have the AMD chip and heatsink
installed now. The AMD heatsink came with a heat pad, something I wasn't
readily familiar with.

You mean "thermal pad," a "heat pad" is a heating device used to sooth
sore muscles after exercising.

How sensitive is this stuff?

To what? If you mean physical damage, it shouldn't be used if it's
been physically damaged (you can check by visual inspection). It's
not recommended to re-use them, because if you pull the HSF, it will
tear the thermal pad resulting in uneven coverage. The recommended
course of action in that case is to scrape off the pad with a plastic
card (eg. credit card or debit card) and replace the pad with thermal
compound (a dab, like a 0.5mm sphere, is adequate for installing a
CPU).

I'd be lying if I said
my finger didn't brush against it before installing it.

Touching it won't be a problem. Damage caused by scraping it with a
fingernail could be. Visual inspection will reveal any physical
damage. If you see any, scrape it all off and replace it with thermal
compound. Some recommend wiping the heatsink face down with 90+%
isopropyl alcohol or acetone before applying the thermal compound.

Also, I tried
seating it once or twice before I finally got the heatsink installed and
clipped into place. I noticed it left a bit of a print on the chip after
making contact the first time. Is this all right, or should I remove it,
clean it (with what?) and apply the compound? Thanks.


Depends. Have a look and see if the pad is damaged. If in doubt,
scrape it off and use compound.
---------------------------------------------
Thanks.


MCheu


.



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